sm9336 bce s 250 000 press sensor 250pa differential i2c te connectivity BINDER - 79-3108-52-04 - Circular For FPGA Development Boards
Description
sm9336 bce s 250 000 press sensor 250pa differential i2c te connectivity BINDER 79 3108 52 04 Circular For FPGA Development Boards BINDER 79 3108 52 04 Circular Cable Assembly Wire Size (AWG): 22AWG to 20AWG I2C Digital Dual Axial
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